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RF Device Data
Freescale Semiconductor, Inc.
AFT09MS031NR1 AFT09MS031GNR1
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents, software and tools to aid your design process.
Application Notes
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AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages
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AN1955: Thermal Measurement Methodology of RF Power Amplifiers
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AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
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AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
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EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
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Electromigration MTTF Calculator
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RF High Power Model
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.s2p File
Development Tools
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Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the ?Part Number? link. Go to the
Software & Tools tab on the part?s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
May 2012
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Initial Release of Data Sheet
1
Aug. 2012
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Load Mismatch/Ruggedness tables: changed output power to
input power to clarify the conditions used
during test, p. 1, 8
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Fig. 10, Broadband Reference Circuit Component Layout ? 760--870 MHz: added C18 and C19;
replaced L1 with R1 and L2 with L1, p. 9
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Table 10, Broadband Reference Circuit Component Designations and Values ? 760--870 MHz: changed
C14 description from 0.10
μFto10μF and part number from GRM21BR71H104KA01B to
GRM31CR61H106KA12L; changed C15 description from 0.01
μFto1μF and part number from
GRM21BR72A103KA01B to GRM21BR71H105KA12L; changed C17 description from 22 pF to 240 pF
and part number from ATC100A220JT150XT to ATC600F241JT250XT; added C18 and C19; replaced L1
with R1 and L2 with L1, p. 9
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Fig. 11, Broadband Reference Circuit Schematic ?
760--870 MHz: added C18 and C19; replaced L1 with
R1 and L2 with L1, p. 10
Modifications to Fig. 10, Table 10 and Fig. 11 will improve stability of the test circuit and improve performance
under a modulated signal, p. 9, 10